Eects of T5 Treatment on Microstructure andMechanical Properties at Elevated Temperature of AZ80-Ag Alloy
  
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Release time:2021-07-12  
        
        
        
        
        
             
             DOI number:10.3390/ma12193214  
             
             
             Journal:Materials  
             
             
             Key Words:AZ80-Ag alloy; T5 treatment; creep; precipitation.  
             Abstract:Effects of T5 treatment on microstructure and mechanical properties at elevated temperature of hot-ring-rolled (HRRed) AZ80-Ag magnesium alloy were systematically investigated. Results show that, after aging at 175 °C for 36 h, discontinuous and continuous precipitates form inside grains, with the former one taking up a volume fraction of ~64.9%. T5 treatment improves the tensile strength at ambient temperature of the alloy but weakens its tensile strength and creep resistance at elevated temperatures (120-175 °C), indicating opposite effects of T5 on mechanical properties at ambient and elevated temperatures. During creep at 120-175 °C and under 70-90 MPa, the dynamic precipitation process in HRRed specimen is accelerated with increasing temperature. At 150-175 °C massive nucleation and growth of dynamic discontinuous precipitates could result in an atypical primary creep stage, consisting of deceleration and acceleration creep stages, which is reported in wrought Mg-Al-based alloy for the first time. Such primary creep stage can be eliminated by T5 treatment. Besides, diffusion-controlled dislocation creep is the dominant creep mechanism for both HRRed and T5 specimens.  
             
             Co-author:Chuming Liu, Shunong Jiang, Shilun Yu, Zhiyong Chen  
             First Author:Gang Zeng  
             Indexed by:Journal paper  
             Correspondence Author:Yonghao Gao  
             Document Code:3214  
             
             
             
             Volume:12  
             
             
             
             
             Translation or Not:no  
             
             Date of Publication:2019-09-30  
             Included Journals:SCI  
             
    
    
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