Ultrasonic Bonding Mechanism and Technology in Microelectronic packaging
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Release time:2016-04-18 Faculty/School:School of Mechanical and Electronical Engineering Publisher:Science Press Place of Publication:Beijing Description of Publication:《微电子封装超声键合机理与技术》是作者关于超声键合机理和技术研究的总结。主要内容包括：微电子制造的发展，超声键合在封装互连中的地位、研究现状、存在问题；换能系统的设计原则、仿真手段和实际使用中的特性测试；对超声键合微观实验现象以及机理的科学认识和推断；热超声倒装键合工艺的技术研究；键合过程和键合动力学的检测；叠层芯片互连；铜线键合、打火成球、引线成形、超声电源。 School Sign:Central South University The First Author:隆志力, 李军辉, 王福亮, 韩雷 Type of Works:Works Publication Design:Central publishing house Classification of Disciplines:机械工程 ISBN No.:7030412141 Translated or Not:no Number of Words:798000 Date of Publication:2014-06-01 -
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 Postal Address:3d7bbc3128343b2ca36aac379e8f04b3c7e5eb4131a456b9e6dfd194779a5c0a61440680a74015c781844560866895c8cd0692e634a2b361e06993fe1d06c06c68cc8b604296f4558dec9855a577f10c9b5438318d111d29286f0847dfa2f7ad01f930a6cdfc6dbfdfd8e42a0a4f46c7af649b09434ca2904dab8e707cae15ec Mobile:bb64de6b083d2d96029f0747d5e14f9067a726f05a810f6d1f79748474eb523f0973023af42edddf972d51580492ab77cf503f657a25b6c1a5400c5ba3b2e884e0cbc0139b985cc1791a315cd43019b51f1411006a3370b76bdaa6a7415840395c7aea7c6a2181920584b0bec4e30369e705202d12cdc4fa4c04fad3e5002c34 Email:00c2eff53d5748e084379825d9797c9b72df22d8b7698c0448e363d4f3a5c490e2bc28b1ea695164e77f14101312c365fc6419069d8d5f523dfaee9bbcdeaef97c190550918447b19004e90846f24e4b2c96f227bd9fff73033217d8ff0653191585b74731e00a09c758e2962f6dd55b41a4633f08a8d2fe50f1277bfe87efb2
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