中文

Progress of Advanced Packaging in Microelectronics Manufacturing

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  • Release time:2016-04-18

  • Faculty/School:School of Mechanical and Electronical Engineering

  • Publisher:Central South University Press

  • Place of Publication:Changsha

  • School Sign:Central South University

  • The First Author:Wang Fuliang(王福亮), Li Junhui(李军辉), Han Lei(韩雷)

  • Type of Works:Thesis

  • Publication Design:Local publishing house

  • Classification of Disciplines:机械工程

  • ISBN No.:978-7-5487-0709-7

  • Translated or Not:no

  • Number of Words:433000

  • Date of Publication:2012-12-11


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