Progress of Advanced Packaging in Microelectronics Manufacturing
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Release time:2016-04-18
Faculty/School:School of Mechanical and Electronical Engineering
Publisher:Central South University Press
Place of Publication:Changsha
School Sign:Central South University
The First Author:Wang Fuliang(王福亮), Li Junhui(李军辉), Han Lei(韩雷)
Type of Works:Thesis
Publication Design:Local publishing house
Classification of Disciplines:机械工程
ISBN No.:978-7-5487-0709-7
Translated or Not:no
Number of Words:433000
Date of Publication:2012-12-11
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Mobile:bb64de6b083d2d96029f0747d5e14f9067a726f05a810f6d1f79748474eb523f0973023af42edddf972d51580492ab77cf503f657a25b6c1a5400c5ba3b2e884e0cbc0139b985cc1791a315cd43019b51f1411006a3370b76bdaa6a7415840395c7aea7c6a2181920584b0bec4e30369e705202d12cdc4fa4c04fad3e5002c34
Email:00c2eff53d5748e084379825d9797c9b72df22d8b7698c0448e363d4f3a5c490e2bc28b1ea695164e77f14101312c365fc6419069d8d5f523dfaee9bbcdeaef97c190550918447b19004e90846f24e4b2c96f227bd9fff73033217d8ff0653191585b74731e00a09c758e2962f6dd55b41a4633f08a8d2fe50f1277bfe87efb2
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