Effect of stamping deformation on microstructure and properties evolution of an Al–Mg–Si–Cu alloy for automotive panels
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Release time:2019-04-10 DOI number:10.1007/s10853-016-0278-9 Journal:Journal of Materials Science Co-author:S. Liu, X. He, J. Wang, Y. Kong, P. Zhao, Y. Du First Author:M. Yang Indexed by:Journal paper Correspondence Author:K. Li* Volume:52 Page Number:5569-5581 Translation or Not:no Date of Publication:2017-05-01 Included Journals:SCI、EI Links to published journals:https://doi.org/10.1007/s10853-016-0278-9 -
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 Email:296551314ebe86f657f464a33aca70288aea001f837a3367a731e2258d342d697c38a314d9e39982c71536b1a95d6e8b569c5e37a520b9db9fbd2c5f96075c663571e06ee1adfb86b6166aa22d88fb385fc21d614bdecf5f0b3d2d7f190c4fb31dab43c05a132c7e135521602fae22e717c98944db0f74c613a7d9d0682af790 Postal Address:9a0822cb3a221826ba9b3426e07adcefcbffca45c496c485b18b67463b1d13c42d855c8dfcf986fb3470913366efdee27c9a81bcde9433a154326f8b8538efba4308eca802030e7a187d47e4a808cfbf2204723b4e6a7fc7a20208cdf5923ea333330cc94e2b6020d32af584eae3c96d9ae8d4afcaf8d636636f78118d2f8c63
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