中文

一种无需测厚的晶粒尺寸超声无损评价方法

Hits:

  • Release time:2017-07-12

  • Disigner of the Invention:刘希玲, 杨岳, 刘锋, 司家勇, 胡宏伟, 倪培君, 高广军, 田红旗, 宋永锋, 李雄兵

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL 201410478957.7

  • Service Invention or Not:no

  • Application Date:2014-09-19

  • Authorization Date:2017-05-10


  • Postal Address:

  • Office Phone:

  • Email:

Central South University  All rights reserved  湘ICP备05005659号-1 Click:
  MOBILE Version

The Last Update Time:..