一种无需测厚的晶粒尺寸超声无损评价方法
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Release time:2017-07-12 Disigner of the Invention:刘希玲, 杨岳, 刘锋, 司家勇, 胡宏伟, 倪培君, 高广军, 田红旗, 宋永锋, 李雄兵 Type of Patent:Invent State of Patent:Authorized patents Authorization number:ZL 201410478957.7 Service Invention or Not:no Application Date:2014-09-19 Authorization Date:2017-05-10 -
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 Postal Address:23851819aa5eb2fe2cd712c0d730c5888f485623fa8adc7e4120d37d1a4be6c24c1bb96e47515c93119c4198597302ab1800a1e5b1f3b226042539e8c9645737bd3d64e605887f49722b9ea4b6a732d783bf5f25a094758be3d1adf41068d38d452ef5e0e5e8339aa5848b2f413f95c2f0739e9366641b5a30233348019cf54b Office Phone:80a5953a049629d5841520515b7aab7e0755109e96be4c20a78f471bd39dc08740a8ca2d9113e22892f2a608ab9e36cf5edbbe356a7f82a5974a6ce7fce63ab852b399e440911fe6ab967f095b39db887d419a7efb92c5023fbaa19435d613f762f0a4120629730edbee6199d5f277f48e382578afff6ef75491b61af2e4c4fb Email:3a7df5d23d271514757c9db8c3ffd1ead7e8d1f19f8e63d8dd403833f59a628b4cc8f57bc2469a17c468f1d849f115ab8e3509abecda87e0ea984dfc8f08265bdd70df496c99f8ad36c828bf1e1f6bc125361e041bcd111077fa0fadfc0a90ffaffa935e9ba24fb7f68f3578cd9a4eebca6a44ea620f2c5e76f9ccd9fdab85b6
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