A polymer microfluidic chip inner bonding method for molding

Release time:2016-04-13

Affilication of Author(s):Central South University

Teaching and Research Group:Institute of Mold Technology of CSU

School Sign:Central South University

Patent Applicant:中南大学

Disigner of the Invention:楚纯朋, 刘瑶, 蓝才红, 蒋炳炎

Type of Patent:Invent

State of Patent:Authorized patents

Application Number:CN200910043703.1

Number of Inventors:4

Service Invention or Not:no

Application Date:2009-06-18

Publication Date:2009-11-11

First Author:蒋炳炎