中文

A polymer microfluidic chip inner bonding method for molding

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  • Release time:2016-04-13

  • Affilication of Author(s):Central South University

  • Teaching and Research Group:Institute of Mold Technology of CSU

  • School Sign:Central South University

  • Patent Applicant:中南大学

  • Disigner of the Invention:楚纯朋, 刘瑶, 蓝才红, 蒋炳炎

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Application Number:CN200910043703.1

  • Number of Inventors:4

  • Service Invention or Not:no

  • Application Date:2009-06-18

  • Publication Date:2009-11-11

  • First Author:蒋炳炎


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