中文

Microfluidic injection molding and bonding mold

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  • Release time:2016-04-13

  • Affilication of Author(s):Central South University

  • School Sign:Central South University

  • Patent Applicant:中南大学

  • Disigner of the Invention:周洲, 楚纯朋, 蒋炳炎

  • Type of Patent:Utility models

  • State of Patent:Authorized patents

  • Application Number:CN201020605010.5

  • Number of Inventors:3

  • Service Invention or Not:no

  • Application Date:2010-11-12

  • Publication Date:2011-06-15

  • First Author:蒋炳炎


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