Microfluidic injection molding and bonding mold

Release time:2016-04-13

Affilication of Author(s):Central South University

School Sign:Central South University

Patent Applicant:中南大学

Disigner of the Invention:周洲, 楚纯朋, 蒋炳炎

Type of Patent:Utility models

State of Patent:Authorized patents

Application Number:CN201020605010.5

Number of Inventors:3

Service Invention or Not:no

Application Date:2010-11-12

Publication Date:2011-06-15

First Author:蒋炳炎