中文

一种全彩氮化镓基LED芯片立式封装体

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  • Release time:2018-11-07

  • Note:彭效冉,赵辉,张逸韵,汪炼成,宋亮,刘玉蕾,谢海忠

  • Type of Patent:Utility models

  • Application Number:201520489338.8

  • Service Invention or Not:no


  • Email:

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