个人简介
副教授，2014年于美国田纳西大学材料科学与工程学院获得博士学位。2012年至2014年，在美国橡树岭国家实验室纳米材料科学中心进行研究。2015年加入中南大学粉末冶金研究院。在Nature Communications，Chemical Engineering Journals，Physical Review Letters，Nano Letters，Chemistry of Materials， Nano Research等国际知名期刊上发表论文50余篇。承担、参与国家级、省部级项目10余项。主要研究兴趣为微纳电子封装材料、半导体单晶材料、新型一维纳米线的基础研究和应用开发。
本课题组依托中南大学粉末冶金研究院、“2011”有色金属协同创新中心等大型研究平台，具有世界一流的材料表征仪器，以及理论计算合作团队。同时课题组与国际顶尖橡树岭国家实验室有长期合作关系，可以提供出国交流访问机会。
课题组隶属于刘文胜教授特种粉体材料研究组。刘文胜教授为“长江学者”特聘教授，国家“863”计划新材料技术领域“特种材料研发”重大项目总体专家组成员，中国材料研究学会常务理事，中国材料研究学会青年工作委员会副主任，“国家能源新材料技术研发中心”理事、学术委员会委员等。
电子邮箱： siweitang@csu.edu.cn
近年学术成果如下：
Hierarchically structured nano silver powder with dual-scale architecture enabling low-temperature high-conductivity photovoltaic pastes
Journal of Materials Science: Materials in Electronics
2026-05 | Journal article
DOI: 10.1007/s10854-026-17520-5
Contributors: Jinhua Qin; Chenhe Zhang; Jin Yang; Zhe Huang; Yunzhu Ma; Wensheng Liu; Siwei Tang
Transient liquid phase sintering with nanophase reinforcement enables silver joints with low thermal resistance and high shear strength
Intermetallics
2026-01 | Intermetallics
Contributors: Yiming Xu; Jiaying Zhang; Xuanjue Hu; Yiding Yu; Wenhao Gao; Jinhua Qin; Yunzhu Ma; Wensheng Liu; Siwei Tang; Zhongkun Lin et al.
Multi-step transient liquid phase bonding of Ag-In-Sn composite solders joints for low interfacial thermal resistance and enhanced mechanical integrity
Materials Characterization
2025-11 | Journal article
Shape-engineered silver nanoparticles toward high-strength interconnects in electronic packaging
Journal of Materials Science: Materials in Electronics
2025-11 | Journal article
Damascus-style hierarchical microstructures enable a strong and ductile medium-entropy alloy
Nature Communications
2025-10-31 | Journal article
DOI:
Contributors: Siwei Tang; Guangxiong Luo; Panzhen Li; Baishan Chen; Zhe Huang; Jing Yang; Yunzhu Ma; Wensheng Liu; Chaoping Liang
Atomized droplet reaction for preparing fine silver nanoparticles with enhanced interfacial bonding and thermal conductance
Chemical Engineering Journal
2025-09 | Journal article
DOI: 10.1016/j.cej.2025.166175
Part of ISSN: 1385-8947
Contributors: Jin Yang; Zhe Huang; Jinhua Qin; Baishan Chen; Siwei Tang; Yunzhu Ma; Wensheng Liu
Size-controlled synthesis of ultrafine silver powders for electronic paste using a one-pot aqueous method
Materials & Design
2025-04 | Journal article
DOI:
Contributors: Zhe Huang; Jin Yang; Baishan Chen; Minggang Li; Siwei Tang; Yunzhu Ma; Wensheng Liu
Low resistivity achieved through enhanced sintering activity in silver paste with submicron particles created through nanoparticle self-assembly
APL Materials
2025-02-01 | Journal article
Contributors: Chenhe Zhang; Zhe Huang; Panzhen Li; Jin Yang; Siwei Tang; Yunzhu Ma; Wensheng Liu
Container-free microfluidic chemical reduction for synthesizing ultrafine silver powder and fabricating silver paste
Journal of Alloys and Compounds
2025-01 | Journal article
Contributors: Panzhen Li; Zhe Huang; Jin Yang; Chenhe Zhang; Siwei Tang; Yunzhu Ma; Wensheng Liu
Optimizing Silver Paste Conductivity with Controlled Convection for Nanowrinkle Growth
ACS Applied Materials & Interfaces
2024-07-03 | Journal article
DOI:
Contributors: Panzhen Li; Zhe Huang; Jin Yang; Chenhe Zhang; Siwei Tang; Yunzhu Ma; Wensheng Liu
Exploration of organic matrixes in conductive silver paste: a comprehensive review
Journal of Materials Science: Materials in Electronics
2024-06 | Journal article
DOI:
Contributors: Jin Yang; Haonan Dong; Zhe Huang; Baishan Chen; Siwei Tang; Yunzhu Ma; Wensheng Liu
Enhanced performance CdZnTe single crystal with few surface damages via solution based annealing
Sensors and Actuators A: Physical
2024-04 | Journal article
DOI: 10.1016/j.sna.2024.115168
Interactions between intermediates in the preparation of silver nanocubes and their impact on the final morphology
Journal of Crystal Growth
2024-02 | Journal article
Contributors: Haonan Dong; Zhe Huang; Baishan Chen; Panzhen Li; Chenhe Zhang; Yunzhu Ma; Wensheng Liu; Siwei Tang
Growth of intermetallic compounds and their reinforcement on CrCoNi/Au80Sn20 soldering interfaces
Intermetallics
2024-01 | Journal article
DOI:
Contributors: Haonan Dong; Zhe Huang; Panzhen Li; Siwei Tang; Baishan Chen; Yunzhu Ma; Wensheng Liu
Fe Doping-Induced Magnetic Solitons in CrNb3S6
Journal of Electronic Materials
2023-11 | Journal article
DOI:
Contributors: Siwei Tang; Panzhen Li; Haonan Dong; Baishan Chen; Zhe Huang; Haiguo Tang
Tailoring the defects and resistivity in CdZnTe single crystal via one-step annealing with CdTe compound
Vacuum
2023-11 | Journal article
DOI:
Contributors: Zhe Huang; Siyuan Wu; Baishan Chen; Siwei Tang; Yunzhu Ma; Wensheng Liu
Exploring the Magnetic Behavior of a Magnetic High-Entropy Alloy with Dual-Phase B20 Crystal Structure
Journal of Superconductivity and Novel Magnetism
2023-09 | Journal article
DOI:
Contributors: Siwei Tang; Haonan Dong; Zhe Huang; Baishan Chen; Haiguo Tang
Investigation of 1-hexanol base silver paste formula for low-temperature sintering
Journal of Materials Science: Materials in Electronics
2023-09 | Journal article
DOI:
Contributors: Zhe Huang; Haonan Dong; Baishan Chen; Siwei Tang; Yunzhu Ma; Wensheng Liu
Tuning the Disconnected Magnetic Phase by Regulating the Lattice Distortion in FeSi1−xGex Alloys
Journal of Electronic Materials
2023-02 | Journal article
DOI:
Contributors: Siyuan Wu; Zhe Huang; Baishan Chen; Xiao Liu; Ping Lin; Yunzhu Ma; Siwei Tang; Wensheng Liu
Identification of twin and nanoscale Te precipitations in CdZnTe crystals grown by vertical gradient method with HRTEM
Materials Characterization
2022-03 | Journal article
DOI: 10.1016/j.matchar.2022.111739
Part of ISSN: 1044-5803
Contributors: Siyuan Wu; Zhe Huang; Baishan Chen; Xiao Liu; Yunzhu Ma; Yufeng Huang; Siwei Tang; Chaoping Liang; Wensheng Liu
Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder
Journal of Materials Science: Materials in Electronics
2021-05-27 | Journal article
DOI:
Contributors: Xiao Liu; Siyuan Wu; Baishan Chen; Yunzhu Ma; Yufeng Huang; Siwei Tang; Wensheng Liu
Growth of the nano-phase intermetallic compounds and its effect on mechanical behavior of Au80Sn20/CrMnFeCoNi solder joints during isothermal aging
Journal of Alloys and Compounds
2021-04 | Journal article
DOI: 10.1016/j.jallcom.2020.157823
Part of ISSN: 0925-8388
Contributors: Xiao Liu; Baishan Chen; Siyuan Wu; Yunzhu Ma; Siwei Tang; Zhenggang Wu; Yufeng Huang; Wensheng Liu
Tuning the Electrical Resistivity of Conductive Silver Paste Prepared by Blending Multi-Morphologies and Micro-Nanometers Silver Powder
2021-03-06 | Other
DOI:
Contributors: Liu Xiao; Wu Siyuan; Chen Baishan; Ma Yunzhu; Huang Yufeng; Siwei Tang; Liu Wensheng
Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests
Journal of Materials Science: Materials in Electronics
2020-11 | Journal article
DOI: 10.1007/s10854-020-04438-9
Contributors: Ping Lin; Wensheng Liu; Yunzhu Ma; Yufeng Huang; Siwei Tang
Effect of added Ag on plasticity enhancement of Au80Sn20 eutectic alloys
Journal of Alloys and Compounds
2020-11 | Journal article
DOI: 10.1016/j.jallcom.2020.155849
Part of ISSN: 0925-8388
Contributors: Yufeng Huang; Wensheng Liu; Yunzhu Ma; Siwei Tang; Feng Xue; BaiShan Chen; Juan Wang
Formation of nano-phase Co3Fe7 intermetallic and its strengthening in Au80Sn20/CrMnFeCoNi solder interface
Journal of Alloys and Compounds
2020-11 | Journal article
DOI: 10.1016/j.jallcom.2020.155924
Part of ISSN: 0925-8388
Contributors: Xiao Liu; Baishan Chen; Siyuan Wu; Ping Lin; Yunzhu Ma; Siwei Tang; Yufeng Huang; Wensheng Liu
Effects of multiple reflows on microstructure and shear strength of (Au-20Sn)-2Ag/Au/Ni(P)/Kovar joints
Materials Science and Engineering: A
2020-06 | Journal article
DOI: 10.1016/j.msea.2020.139568
Part of ISSN: 0921-5093
Contributors: Baishan Chen; Yufeng Huang; Siwei Tang; Wensheng Liu; Yunzhu Ma
Tuning Magnetic Soliton Phase via Dimensional Confinement in Exfoliated 2D Cr1/3NbS2 Thin Flakes.
Nano letters
2018-05 | Journal article
DOI: 10.1021/acs.nanolett.8b01546
PMID: 29719147
Contributors: Tang S; Fishman RS; Okamoto S; Yi J; Zou Q; Fu M; Li AP; Mandrus D; Gai Z
教育经历
[1] 2002.9-2006.6
中南大学 | 测控技术与仪器 | 学士学位 | 大学本科
[2] 2006.9-2009.7
中南大学 | 材料科学与工程 直博
[3] 2009.8-2011.8
美国田纳西大学 | 材料科学与工程 | 硕士学位 | 研究生
[4] 2011.9-2014.6
美国田纳西大学/橡树岭国家实验室 | 材料科学与工程 | 博士学位 | 研究生
社会兼职
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[1] 2025.1-至今
《电子与封装》青年编委 -
[2] 2024.9-至今
《中国有色金属学报》青年编委 -
[3] 2024.9-至今
《中南大学学报》青年编委 -
[4] 2025.9-至今
《材料基因工程前沿》青年编委 -
[5] 2026.1-至今
湖南省科技特派员 -
[6] 2026.9-至今
中国黄金集团中原新材料有限责任公司科技副总经理