Dr. Zhu Wenhui, male, doctor supervisor, is professor with Central South University, China. Chief Scientist of “Fundamental Research on Wafer-Level 3D Integration for 20/14nm ICs” which is the 1st National Basic Research Program(973) in 3D IC integration. He was elected as Specially invited “1000 Elite Plan Expert(2011)” of China, top class Talent plan. His main research direction three dimensional integration and testing of nano/micro electronics Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co., member of IEEE and invited professor of Beijing University of Technology. He is a key player of IEEE ICEPT and EPTC conference as organization committee or technical sub-comittee chairman / co-chairman. Dr. Zhu is also reviewer of a few international journals in packaging areas. He has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon, UTAC and Tian Shui Hua Tian / Qtech. Dr. Zhu chaired many key projects in advanced packaging and structural integration such as national 863 project, Chinese natural science fund, and state key technology projects and made great achievements in technology innovation and cost-saving. He has been invited to give keynote talks and short courses in international forums and conferences. Dr. Zhu has published more than 100 technical papers and won 3 times of best paper awards.