Journal Publications

• [1]Wenhui Zhu, Yang Xia, Hu He, Ji’an Duan, Duo Wang, Junhui Li*.Structural Design and Control of a Small-MRF Damper Under 50 N Soft-Landing Applications[J].IEEE Transactions on Industrial Informatics, 2015, 11 (3) : 612-619.
• [2]Wenhui Zhu, Hu He, Yang Xia, Wei Wang, Junhui Li*.The soft-landing features of a micro-magnetorheological fluid damper[J].Applied Physics Letters, 2015, 106 (1) : 85.
• [3]Zhu Wenhui, Zhang Wei, Wang Fuliang, Wang Wei, Xia Yang, Li Junhui*.Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras-speedCameras[J].Nano-Micro Letters, 2015, 7 (1) : 1-11.
• [4]ZHU Wenhui, AN Tong, GAO Cha, XIA Guofeng, QIN Fei.Design of Experiment Methodology for Thermal Fatigue Reliability of Multi-row QFN Packages Based on Numerical Simulations[J].Journal of Mechanical Engineering, 2014, 50 (18) : 92-98.
• [5]Wenhui Zhu, Tong An, Cha Gao, Fei Qin, Guofeng Xia.Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method[J].Journal of Electronic Packaging, 2013, 135 (4) : 119-132.
• [6]W.H. Zhu, John Lau, O.K. Kanvas, M.L. Thew, W.Y. Hnin, V.N. Sekhar, H.Y. Li, X. Zhang, T.C. Chai.Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect[J].IEEE Transactions on Components Packaging & Manufa, 2012, 2 (5) : 807-816.
• [7]高察, 马晓波, 朱文辉, 秦飞, 夏国峰.LQFP和eLQFP热机械可靠性的有限元分析[J].半导体技术, 2012, 37 (7) : 552-557.
• [8]朱文辉, 于大全, 万里兮, 王珺, 秦飞.TSV结构热机械可靠性研究综述[J].半导体技术, 2012, 37 (11) : 835-831.
• [9]X.R.ZHANG, T.C. CHAI, X.W.ZHANG, EDITH POH, W.H. ZHU, F.X.CHE.Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Doping[J].Journal of Electronic Materials, 2011, 40 (3) : 344-354.
• [10]X.R. Zhang, X.W. Zhang, Edith Poh, W.H. Zhu, F.X. Che.The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures[J].Journal of Alloys and Compounds, 2010, 507 (1) : 215-224.
• [11]T.C. Chong, X.W. Zhang, W.H. Zhu, F.X. Che.Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods[J].IEEE Transactions on Device and Material Reliabili, 2008, 8 (3) : 455-463.
• [12]S. L. Gan, Sharry Ang, W.H.Zhu*.Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range[J].Journal of Materials Science, 2005, 40 (6) : 1533-1537.
• [13]W.H. Zhu*, W. C. Tjiu, K. C. Toh, J. W. Chai, J. S. Pan, Diganta Das, M. Pecht, T.Y. Lin.The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process[J].IEEE Transactions on Components and Packaging Tech, 2005, 28 (2) : 377-344.
• [14]M.Yoshida, W.H. Zhu*.Spall strength of thin aluminum foils at ultra high strain rate[J].Journal of Materials Science Letters, 2002, 21 (20) : 1569-1572.
• [15]S. Tanimura, K. Kondo, H. Tamura, M. Yoshida, W.H. Zhu*.Multiple spalling of aluminum subjected to a pico-second stress pulse[J].Journal of Materials Science Letters, 2001, 20 (10) : 961-963.
• [16]S. Tanimura, K. Kondo, H. Tamura, M. Yoshida, W.H. Zhu*.Multiple spallation in aluminum induced by ultra-short stress pulses[J].Special issue of International Journal of Material, 117 (3)
• [17]W.H. Zhu*, K. Mimura, S. Tanimura.A dynamic constitutive equation and its experimental verification[J].Journal de Physique IV, 2000, 10 (Pr9) : 33-38.
• [18]K. Mimura W.H. Zhu*, S. Tanimura.Practical constitutive models covering wide ranges of strain rates, strains and temperature[J].Key Engineering Materials, 2000, 177-180: 189-200.
• [19]S. Tanimura, G. Shi, W.H. Zhu*.Effect of soft material on insulating impact pressure into explosive[J].Key Engineering Materials, 2000, 177-180: 237-242.
• [20]Z.Y. Li, T.X. Yu, W.H. Zhu*.Laser induced shock waves in PMMA confined foils[J].International J. of Impact Engineering, 2000, 24 (6-7) : 641-657.