Research Projects

• [1]Ministry of Science and Technology of the People's Republic of China:Fundamental Research on Wafer-Level 3D Integration for 20/14nm ICs,朱文辉,立项时间:2015-01-01
• [2]Ministry of Science and Technology of the People's Republic of China:The evolution mechanism of physical properties at the micro-interconnect interface and collaborative design of the entire physical process based on manufacturing and serving,朱文辉,立项时间:2015-01-01
• [3]Ministry of Science and Technology of the People's Republic of China:Research, Development and Mass Production of Multi-ring V/UQFN, FCQFN and AAQFN packaging technology,朱文辉,立项时间:2011-01-01
• [4]Ministry of Science and Technology of the People's Republic of China:Application engineering of communication and multimedia chip package testing equipment and material,朱文辉,立项时间:2012-01-01
• [5]Design and simulation analysis platform buliding,朱文辉,立项时间:2011-01-01
• [6]Copper wire technology improving and flip-chip development and mass production platform building,立项时间:2013-01-01
• [7]Fast MPP platform building for high density flip chip packaging,立项时间:2013-01-01