The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process
发布时间:2016-04-28
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发表刊物:IEEE Transactions on Components and Packaging Tech
备注:T.Y. Lin, M. Pecht, Diganta Das, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu, W.H. Zhu*, The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process, IEEE Transactions on Components and Packaging Technologies (2005): 28(2), 377-344.
合写作者:W.H. Zhu*, W. C. Tjiu, K. C. Toh, J. W. Chai, J. S. Pan, Diganta Das, M. Pecht, T.Y. Lin
文献类型:J
卷号:28
期号:2
页面范围:377-344
是否译文:否
发表时间:2005-01-01