The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process
发布时间：2016-04-28
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发表刊物：IEEE Transactions on Components and Packaging Tech
备注：T.Y. Lin, M. Pecht, Diganta Das, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu, W.H. Zhu*, The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process, IEEE Transactions on Components and Packaging Technologies (2005): 28(2), 377-344.
合写作者：W.H. Zhu*, W. C. Tjiu, K. C. Toh, J. W. Chai, J. S. Pan, Diganta Das, M. Pecht, T.Y. Lin
文献类型：J
卷号：28
期号：2
页面范围：377-344
是否译文：否
发表时间：2005-01-01