Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range
发布时间:2016-04-28
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发表刊物:Journal of Materials Science
合写作者:S. L. Gan, Sharry Ang, W.H.Zhu*
文献类型:J
卷号:40
期号:6
页面范围:1533-1537
是否译文:否
发表时间:2005-01-01