Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect
发布时间:2016-04-28
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发表刊物:IEEE Transactions on Components Packaging & Manufa
备注:T.C. Chai, X. Zhang, H.Y. Li, V.N. Sekhar, W.Y. Hnin, M.L. Thew, O.K. Kanvas, John Lau,W.H. Zhul. Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2012, 2(5):807-816.
合写作者:W.H. Zhu, John Lau, O.K. Kanvas, M.L. Thew, W.Y. Hnin, V.N. Sekhar, H.Y. Li, X. Zhang, T.C. Chai
文献类型:J
卷号:2
期号:5
页面范围:807-816
是否译文:否
发表时间:2012-01-01