Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect
发布时间：2016-04-28
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发表刊物：IEEE Transactions on Components Packaging & Manufa
备注：T.C. Chai, X. Zhang, H.Y. Li, V.N. Sekhar, W.Y. Hnin, M.L. Thew, O.K. Kanvas, John Lau,W.H. Zhul. Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2012, 2(5):807-816.
合写作者：W.H. Zhu, John Lau, O.K. Kanvas, M.L. Thew, W.Y. Hnin, V.N. Sekhar, H.Y. Li, X. Zhang, T.C. Chai
文献类型：J
卷号：2
期号：5
页面范围：807-816
是否译文：否
发表时间：2012-01-01