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Fast MPP platform building for high density flip chip packaging

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  • Release time:2016-04-28

  • Affiliation of Participant(s):Huatian Technology（xian）Co., LTD

  • Nature of Project:Development and research

  • Project Number:2013ZX02505-002

  • Date of Project Approval:2013-01-01

  • Scheduled completion time:2015-12-31

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