Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect

Release time:2016-04-28

Journal:IEEE Transactions on Components Packaging & Manufa

Note:T.C. Chai, X. Zhang, H.Y. Li, V.N. Sekhar, W.Y. Hnin, M.L. Thew, O.K. Kanvas, John Lau,W.H. Zhul. Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2012, 2(5):807-816.

Co-author:W.H. Zhu, John Lau, O.K. Kanvas, M.L. Thew, W.Y. Hnin, V.N. Sekhar, H.Y. Li, X. Zhang, T.C. Chai

Document Type:J

Volume:2

Issue:5

Page Number:807-816

Translation or Not:no

Date of Publication:2012-01-01