中文
Home > Patents

多圈排列双IC芯片封装件及其生产方法

Hits:

  • Release time:2016-04-28

  • Disigner of the Invention:郭小伟, 李习周, 慕蔚, 朱文辉

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL201110181831.X

  • Service Invention or Not:no

  • Authorization Date:2013-12-04

  • First Author:朱文辉

  •

Central South University  All rights reserved  湘ICP备05005659号-1 Click:
  MOBILE Version

The Last Update Time:..