一种基板的多层隔片式IC芯片堆叠封装件及其生产方法

Release time:2016-04-28

Disigner of the Invention:王永忠, 慕蔚, 朱文辉, 郭小伟

Type of Patent:Invent

State of Patent:Authorized patents

Authorization number:ZL201110455062.8

Service Invention or Not:no

Authorization Date:2014-06-24

First Author:郭小伟