Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods
发布时间：2016-04-28
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发表刊物：IEEE Transactions on Device and Material Reliabili
摘要：F.X. Che, W.H. Zhu, X.W. Zhang, T.C. Chong, Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods, IEEE Transactions on Device and Material Reliability (2008): 8(3), 455-463.
合写作者：T.C. Chong, X.W. Zhang, W.H. Zhu, F.X. Che
文献类型：J
卷号：8
期号：3
页面范围：455-463
是否译文：否
发表时间：2008-01-01