The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
发布时间:2016-04-28
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发表刊物:Journal of Alloys and Compounds
备注:F.X. Che, W.H. Zhu, Edith Poh, X.W. Zhang , X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures, Journal of Alloys and Compounds (Sep 24, 2010): 507(1), 215-224.
合写作者:X.R. Zhang, X.W. Zhang, Edith Poh, W.H. Zhu, F.X. Che
文献类型:J
卷号:507
期号:1
页面范围:215-224
是否译文:否
发表时间:2010-09-01