The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
发布时间：2016-04-28
点击次数：
发表刊物：Journal of Alloys and Compounds
备注：F.X. Che, W.H. Zhu, Edith Poh, X.W. Zhang , X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures, Journal of Alloys and Compounds (Sep 24, 2010): 507(1), 215-224.
合写作者：X.R. Zhang, X.W. Zhang, Edith Poh, W.H. Zhu, F.X. Che
文献类型：J
卷号：507
期号：1
页面范围：215-224
是否译文：否
发表时间：2010-09-01