Application engineering of communication and multimedia chip package testing equipment and material

Release time:2016-04-28

Affiliation of Participant(s):Tianshui Huatian Technology Co., LTD

Leading Scientist:朱文辉

Supported by:Ministry of Science and Technology of the People's Republic of China

Type of Project:极大规模集成电路制造技术及成套工艺（02专项）

Nature of Project:Development and research

Project Number:2012ZX02601003

Date of Project Approval:2012-01-01

Scheduled completion time:2014-12-31