The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process

Release time:2016-04-28

Journal:IEEE Transactions on Components and Packaging Tech

Note:T.Y. Lin, M. Pecht, Diganta Das, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu, W.H. Zhu*, The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process, IEEE Transactions on Components and Packaging Technologies (2005): 28(2), 377-344.

Co-author:W.H. Zhu*, W. C. Tjiu, K. C. Toh, J. W. Chai, J. S. Pan, Diganta Das, M. Pecht, T.Y. Lin

Document Type:J

Volume:28

Issue:2

Page Number:377-344

Translation or Not:no

Date of Publication:2005-01-01