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Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range

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  • Release time:2016-04-28

  • Journal:Journal of Materials Science

  • Co-author:S. L. Gan, Sharry Ang, W.H.Zhu*

  • Document Type:J

  • Volume:40

  • Issue:6

  • Page Number:1533-1537

  • Translation or Not:no

  • Date of Publication:2005-01-01

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