中文
Home > Journal Publications

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Doping

Hits:

  • Release time:2016-04-28

  • Journal:Journal of Electronic Materials

  • Co-author:X.R.ZHANG, T.C. CHAI, X.W.ZHANG, EDITH POH, W.H. ZHU, F.X.CHE

  • Document Type:J

  • Volume:40

  • Issue:3

  • Page Number:344-354

  • Translation or Not:no

  • Date of Publication:2011-03-01

  •

Central South University  All rights reserved  湘ICP备05005659号-1 Click:
  MOBILE Version

The Last Update Time:..