The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

Release time:2016-04-28

Journal:Journal of Alloys and Compounds

Note:F.X. Che, W.H. Zhu, Edith Poh, X.W. Zhang , X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures, Journal of Alloys and Compounds (Sep 24, 2010): 507(1), 215-224.

Co-author:X.R. Zhang, X.W. Zhang, Edith Poh, W.H. Zhu, F.X. Che

Document Type:J

Volume:507

Issue:1

Page Number:215-224

Translation or Not:no

Date of Publication:2010-09-01