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The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

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  • Release time:2016-04-28

  • Journal:Journal of Alloys and Compounds

  • Note:F.X. Che, W.H. Zhu, Edith Poh, X.W. Zhang , X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures, Journal of Alloys and Compounds (Sep 24, 2010): 507(1), 215-224.

  • Co-author:X.R. Zhang, X.W. Zhang, Edith Poh, W.H. Zhu, F.X. Che

  • Document Type:J

  • Volume:507

  • Issue:1

  • Page Number:215-224

  • Translation or Not:no

  • Date of Publication:2010-09-01


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