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一种BT基板的悬梁式IC芯片堆叠封装件及其生产方法

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  • Release time:2016-04-28

  • Disigner of the Invention:李习周, 郭小伟, 慕蔚, 朱文辉

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL201210098857.2

  • Service Invention or Not:no

  • Authorization Date:2014-09-03

  • First Author:朱文辉

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