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四边扁平无引脚多圈排列IC芯片封装件生产方法及封装件

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  • Release time:2016-04-28

  • Disigner of the Invention:郭小伟, 李习周, 徐召明, 慕蔚, 朱文辉

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL201210173671.9

  • Service Invention or Not:no

  • Authorization Date:2015-06-17

  • First Author:朱文辉

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