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Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods

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Release time:2016-04-28
Journal:IEEE Transactions on Device and Material Reliabili
Abstract:F.X. Che, W.H. Zhu, X.W. Zhang, T.C. Chong, Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods, IEEE Transactions on Device and Material Reliability (2008): 8(3), 455-463.
Co-author:T.C. Chong, X.W. Zhang, W.H. Zhu, F.X. Che
Document Type:J
Volume:8
Issue:3
Page Number:455-463
Translation or Not:no
Date of Publication:2008-01-01

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